DDR4 Main Memory Interposer

Double-data rate fourth-generation (DDR4) main memory technologies are developed by the Joint Electronic Devices Engineering Council (JEDEC) for use in servers, workstations, and high-performance portable applications that require deep memory.

Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to DDR4 main memory buses for debug and compliance verification

Model: -. Category: DDR4. Tags: -

Description
Additional Information

Packaging/Modules

DDR4 main memory is available in standard Ball-Grid-Array (BGA) component packages as well as dual-inline-memory-modules of DIMM and SODIMM. Standard BGA packages are soldered directly to the printed circuit board (PCB) while modules comprise a series of packages in a standard PCB format with standard connections between the DIMM and the main board. Interposers are available for both component packages and DIMM and SODIMM modules.

XH Series

Nexus Technology’s XH Series interposers bring new enhancements to the EdgeProbe™ and Direct Attach types of memory component interposers that maintain signal integrity across the interposer path as well as provide for extremely high-fidelity oscilloscope probe points for both leading edge and emerging memory technologies.